Epoxy systems
BRADCOM offers a selected range of curing agents, intermediates and formulation components for epoxy systems used in protective coatings, industrial flooring, structural adhesives, composites and electrical insulation. From polyetheramines to anhydrides, our portfolio supports the development of systems with different requirements in terms of processability, flexibility, resistance and crosslinking, complemented by epichlorohydrin for resin synthesis and benzyl alcohol for formulation applications.
Curing agents and reactive components
Polyetheramine D230
Low-molecular-weight polyether diamine used as a curing agent and as a component in the preparation of modified curing agents. It is used in epoxy systems for coatings, adhesives and composites where processability and a balance between rigidity and toughness are required.
Tetrahydrophthalic anhydride – THPA
Anhydride curing agent for heat-cured epoxy systems. Used in formulations for electrical components, composites and technical applications, according to thermal resistance, mechanical performance and processing requirements.
Hexahydrophthalic anhydride – HHPA
Cycloaliphatic anhydride curing agent for epoxy systems used in electrical insulation, encapsulation and technical applications. Grade selection and curing cycle depend on the dielectric, thermal and colour stability requirements of the finished component.
Reactive components for modified systems
Polyetheramine D2000
High-molecular-weight polyether diamine used in the formulation of flexible epoxy systems and in the modification of curing-agent blends. It introduces long polyether segments into the network, enabling the flexibility and mechanical behaviour of adhesives, sealants and encapsulation systems to be tailored.
Polyetheramine T5000
High-molecular-weight polyether triamine used in the development of flexibilised epoxy systems. It combines a flexible polyether backbone with three reactive amine end groups, enabling the network architecture and properties of the cured material to be tailored.
Diethyltoluenediamine – DETDA
Aromatic diamine used as a curing agent in specific heat-cured epoxy systems. It is used in composites and technical formulations where the curing cycle and network structure are designed according to the required performance.
Intermediates for resin synthesis
Epichlorohydrin – ECH
Key intermediate in the production of a wide range of epoxy resins, including glycidyl resins derived from phenolic compounds. It is intended for manufacturers synthesising the resin upstream of subsequent formulation with curing agents, pigments and other components.
Formulation components
Benzyl alcohol
Non-reactive solvent used in the formulation of many amine curing agents and epoxy systems. It contributes to viscosity reduction and improved processability, with its effects on curing behaviour and final properties to be evaluated according to dosage and formulation.
Let's define the right supply solution for your business
Share with us the raw materials you are interested in, their applications and your expected requirements. Through our direct relationships with international partners, we will evaluate a sourcing proposal aligned with your production needs.